课程简介

Learn more about system and application level thermal characterization of portable and handheld devices.

In this webinar you will learn how thermal transient testing can be carried out at board and enclosure level.  In order to make sure that an electronics application can maintain its reliability for the expected period, the temperature of the junction where the most important ICs in the system are located, have to be kept reasonably low.  This can be achieved with the use of active and passive cooling solutions, such as fans, heat pipes, thermal interface materials and heat-spreaders.  To understand the effect of these elements on the cooling efficiency, making thermal measurements on the final application can be an excellent approach.  System level thermal characterization however requires detailed understanding of the electrical system as well as more detailed analysis of the results.  In this presentation, we will show some application examples in order to create new ideas for possible test setup and characterization plans.

适应人群

Thermal engineers

Reliability engineers

System engineers

Technical managers

Product marketing managers

课程目录

Applicable boundary conditions for thermal transient testing；

Ways to thermally test complex ICs；

How to qualify the effect of thermal interface materials on a thermal system’s performance；

Thermal testing and analysis of handheld devices, e.g. a mobile phone；